Defects inside silicon wafers can lead to serious incidents.
To remove them, visible light cannot image inside of the wafer.
The need is removing it before proceeding to the next process, and save the waste.

Silicon wafers have the property of transmitting SWIR light, and by using SWIR light, cracks inside the wafer can be imaged by imaging from directly above.
VS-THV-SWIR contributes to image with approximately four times the transmittance at wavelengths of 1000 to 1600nm compared to visible light lenses. *Transmittance varies depending on the wavelength used.
It is compatible with SWIR light and has a lineup of high-magnification optical magnifications from 1.0 to 4.0x, so it’s able to support precision inspections of wafers in units of microns.