Inspection of Silicon Wafer

Inspection of Silicon Wafer

What is the lens selected to improve the accuracy of inspection for abnormalities and foreign particles in patterned circuits on silicon wafers?

●Installed Product

Case Study Digest

Challenges/Issues VS-THV-SWIR Evaluation

・Customer request for higher resolution and inspection accuracy
・Additional request to increase takt time by enlarging the imaging area.

・The SWIR-compatible high-resolution lens can handle the latest high-resolution sensors and improve resolution.
・The high transmittance of the SWIR and the ability to capture images brightly led to an improvement in tact time.

Challenges/Issues

・Customer request for higher resolution and inspection accuracy
・Additional request to increase takt time by enlarging the imaging area.

VS-THV-SWIR Evaluation

・The SWIR-compatible high-resolution lens can handle the latest high-resolution sensors and improve resolution.
・The high transmittance of the SWIR and the ability to capture images brightly led to an improvement in tact time.

About the VS-THV-SWIR series selected to solve the issue in the case study.
About the VS-THV-SWIR series selected to solve the issue in the case study.

See What is Hidden
Telecentric Lenses for 1000nm ~ 1600nm SWIR

・SWIR optimized coaxial light input port
・1.1” & 1” support             
・Optical mag. 1.0x/1.5x/2.0x/3.0x/4.0x, 5 models
・Co-axial lighting

About the VS-THV-SWIR series selected to solve the issue in the case study.

See What is Hidden
Telecentric Lenses for 1000nm ~ 1600nm SWIR

・SWIR optimized coaxial light input port
・1.1” & 1” support             
・Optical mag. 1.0x/1.5x/2.0x/3.0x/4.0x, 5 models
・Co-axial lighting

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