Inspection of Silicon Wafer

Inspection of Silicon Wafer

What is the lens selected to improve the accuracy of inspection for abnormalities and foreign particles in patterned circuits on silicon wafers?

Case Study Digest

Challenges/Issues VS-THV-SWIR Evaluation

・Customer request for higher resolution and inspection accuracy
・Additional request to increase takt time by enlarging the imaging area.

・The SWIR-compatible high-resolution lens can handle the latest high-resolution sensors and improve resolution.
・The high transmittance of the SWIR and the ability to capture images brightly led to an improvement in tact time.

Challenges/Issues

・Customer request for higher resolution and inspection accuracy
・Additional request to increase takt time by enlarging the imaging area.

VS-THV-SWIR Evaluation

・The SWIR-compatible high-resolution lens can handle the latest high-resolution sensors and improve resolution.
・The high transmittance of the SWIR and the ability to capture images brightly led to an improvement in tact time.

About the VS-THV-SWIR series selected to solve the issue in the case study.
About the VS-THV-SWIR series selected to solve the issue in the case study.

See What is Hidden
Telecentric Lenses for 1000nm ~ 1600nm SWIR

・SWIR optimized coaxial light input port
・1.1” & 1” support             
・Optical mag. 1.0x/1.5x/2.0x/3.0x/4.0x, 5 models
・Co-axial lighting

About the VS-THV-SWIR series selected to solve the issue in the case study.

See What is Hidden
Telecentric Lenses for 1000nm ~ 1600nm SWIR

・SWIR optimized coaxial light input port
・1.1” & 1” support             
・Optical mag. 1.0x/1.5x/2.0x/3.0x/4.0x, 5 models
・Co-axial lighting

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