Inspection inside IC chip
Need to inspect the inside of an IC chip for foreign matter and bubbles by penetrating the resin. What product was selected to solve the problem?
●Installed Product
Case Study Digest
| Challenges/Issues | VS-THV-SWIR Series Evaluation |
|---|---|
The internal state of the product could not be determined after resin molding. |
By removing defective parts in advance, substrate loss was reduced. |
Challenges/Issues
The internal state of the product could not be determined after resin molding.
VS-THV-SWIR Series Evaluation
By removing defective parts in advance, substrate loss was reduced.
| About the VS-THV-SWIR series selected to solve the issue in the case study. | |
|---|---|
 |
See What is Hidden ・SWIR optimized coaxial light input port |
About the VS-THV-SWIR series selected to solve the issue in the case study.
See What is Hidden
Telecentric Lenses for 1000nm ～ 1600nm SWIR
・SWIR optimized coaxial light input port
・1.1” & 1” support
・Optical mag. 1.0x/1.5x/2.0x/3.0x/4.0x, 5 models
・Co-axial lighting
Related Product
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- NIR/SWIR
VS-H1-SWIR Series
Specifications, Drawings
