Inspection inside IC chip

Inspection inside IC chip

Need to inspect the inside of an IC chip for foreign matter and bubbles by penetrating the resin. What product was selected to solve the problem?

●Installed Product

Case Study Digest

Challenges/Issues VS-THV-SWIR Series Evaluation

The internal state of the product could not be determined after resin molding.

By removing defective parts in advance, substrate loss was reduced.

Challenges/Issues

The internal state of the product could not be determined after resin molding.

VS-THV-SWIR Series Evaluation

By removing defective parts in advance, substrate loss was reduced.

About the VS-THV-SWIR series selected to solve the issue in the case study.
About the VS-THV-SWIR series selected to solve the issue in the case study.

See What is Hidden
Telecentric Lenses for 1000nm ~ 1600nm SWIR

・SWIR optimized coaxial light input port
・1.1” & 1” support             
・Optical mag. 1.0x/1.5x/2.0x/3.0x/4.0x, 5 models
・Co-axial lighting

About the VS-THV-SWIR series selected to solve the issue in the case study.

See What is Hidden
Telecentric Lenses for 1000nm ~ 1600nm SWIR

・SWIR optimized coaxial light input port
・1.1” & 1” support             
・Optical mag. 1.0x/1.5x/2.0x/3.0x/4.0x, 5 models
・Co-axial lighting

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